Intel has disclosed new details about its fab complex that will resemble a little city August 8, 2021 by admin Tweet Intel says that its latest fab complex will consist of chip packaging facilities and multiple modules that will have the potential of processing wafers by employing its advanced process technologies. Read more… Neowin Related Posts:Microsoft will use Intel Foundry to make its own…Intel is investing $7 billion to improve its…Intel announces Gaudi 3 AI chip, claims it's 50%…Apple and Intel would dominate the 2nm chip race in 2026Intel to make Arm-based chips at its foundry locations
